The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics
The APD1 is a combined annular and precision saw ideal for slicing wafers, crystals or semiconductor components up to 55mm in diameter. It is also suitable for precision dicing of wafers up to 100mm
The GTS1 Thin Section Cut-off and Trim Saw is ideal for geological application areas - cutting hard or soft rocks, concretes or cements with equally high effi ciency.
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